Senior Electronics Quality Engineer

• Review and evaluate PCB CAM and Gerber files for manufacturability, quality, and compliance with industry standards.
• Perform IPC 610 and IPC 620 visual inspections and provide detailed feedback on PCB assembly or wire harness builds.
• Analyze and document surface mount (SMT) and automated optical inspection (AOI) defect types, including the identification and root cause analysis of AOI false calls.
• Apply expertise in counterfeit electronic part detection aligned with AS6081 standards, delivering actionable insights for risk mitigation.
• Conduct and interpret advanced semiconductor package inspections using C-SAM and X-ray imaging, including die inspection and MIL-STD-883 compliance checks.
• Prepare concise, well-written reports and articulate findings verbally to both technical and non-technical stakeholders.
• Collaborate with project leads to refine workflow processes and enhance training datasets for AI development.

• 8+ years of hands-on experience in electronics quality, CAM engineering, or failure analysis, specifically within PCB assembly, wire harness, or semiconductor packaging domains.
• Extensive expertise in IPC-A-610 and IPC/WHMA-A-620 inspection criteria; IPC CIS/CIT certification strongly preferred.
• Demonstrated experience reviewing Gerber data and utilizing PCB CAM software for manufacturability and quality assurance.
• Proficiency in SMT processes, AOI defect analysis, and remediation of false calls in automated inspection systems.
• Direct involvement in counterfeit component screening per AS6081, with knowledge of risk indicators and mitigation strategies.
• Hands-on skills with semiconductor inspection tools such as C-SAM and X-ray, alongside familiarity with MIL-STD-883 procedures.
• Exceptional written and verbal communication skills, ensuring clarity in documentation and knowledge transfer.

Project and contracting process: the hiring partner. Applications continue on the provider's website.