Electrical & Circuit Design Expert

• Evaluate and solve advanced circuit design and electrical engineering problems across multiple domains, including analog, digital, mixed-signal, power, and RF circuits.
• Review and assess AI-generated technical responses for technical correctness, accuracy, and engineering quality.
• Apply practical engineering judgment to real-world design scenarios and theoretical questions.
• Analyze and troubleshoot a wide range of circuit types using industry-standard techniques such as Kirchhoff's laws, node-voltage analysis, small-signal analysis, and phasor analysis.
• Contribute domain expertise to inform model improvements and refine AI reasoning in electrical and circuit design.
• Document feedback and provide clear written and verbal explanations to enhance AI learning and performance.
• Collaborate remotely with a distributed team of experts and project participants.

• No prior experience in AI is required, your domain knowledge is what matters.

• At least 5 years of hands-on experience in analog, digital, mixed-signal, power, or RF circuit design, including participation in hardware that has reached production or tape-out.
• Expert knowledge of analog/mixed-signal design, digital logic, semiconductor devices, power electronics, RF/microwave systems, and control systems.
• Proven ability to analyze complex circuits using Thevenin equivalents, Hybrid-π models, FSMs, and timing analysis.
• Familiarity with semiconductor reliability concerns, EMC, and modern CMOS scaling.
• Professional English proficiency with exceptional written and verbal communication skills.
• Experience with IC/ASIC design, EDA tools (Cadence, Synopsys, Mentor Graphics), PCB design, or high-speed digital/RF system validation is a plus.
• Strongly preferred — evidence of problem-authoring rigor, such as: service on an IEEE/JEDEC/IPC standards committee; an item-writer role on an NCEES or academic qualifying-exam committee; a verified tapeout (Google/efabless open MPW shuttle or documented industry silicon); a top placement or team-lead role in the ISSCC Student Design Contest, DAC Ph.D. Forum, ICCAD CAD Contest, or IEEE SSCS Chipathon; a best-paper award at ISSCC, JSSC/VLSI Symposia, CICC, ESSCIRC, or DAC; a granted patent tied to shipped silicon; or an early-career fellowship/grant (NSF CAREER, DOE Early Career, ONR/AFOSR YIP, DARPA YFA, Sloan Fellowship).

Also listed: attention to detail, remote collaboration.

Project and contracting process: micro1. Applications continue on the provider's website.